ACM Precision Pušetšo Mojule: 6-Axis Micro-Lamignment Powerhouse bakeng sa Automation e bonolo
Engineeded go rarolla nanometer-maemo a go lolamisiwa ga ditlhohlo ka godimo-diintasteri tša go nepagala, modula wa diputseletšo tša nepagalo tša ACM o tliša se se sa bapišwego.6-axis mafolofolo khalemelo .Ka sephutheloana sa ultra-compact. Tshepedišo ye e bohlale e feta tefo ya setšo ya XY/Z ka go oketša peakanyo ya bohlokwa ya sekhutlong, e dira gore e be yeo e sa nyakegego bakeng sa di-photonic, semiconductor, le micro{2}}dikopo tša kopano moo go logaganya sebaka mo go phethagetšego e sego ga go rerišana.
Bokgoni bja setegeniki bja go phuhlama .
✅ Full 6-dof mafolofolo puseletso .
XY Phetolelo:±2mm go ya go ± 2.5mm planar phošollo;z-Seterouku sa axis: .4mm go ya go 10mm phetolo ya go ema;Go dikološa ga XY (RZ): .± 3 tekanyo e pivotal khalemelo;z - axis sekama (rx / ry): .± 6 tekanyo ho ± 2 tekanyo e sekama puseletso.
✅ Sub-Go nepa ga Micron .
E fihlelela go makatša .±0.02mm go nepagala ga go beakanya maemo a go boeletšwa .Ka morago ga go notlela – 5x e botse go feta di-compensator tša intasteri tša maemo.
✅ Taolo ya Matla a Bohlale .
e boloka kgokagano e bonolo e sa fetogego le .z-Tlhahlo ya Selemo sa Taolo (4n ~ 40n min) .le configurable .E -Mode Matla a fapaneng (40n ~ 750n) ..
✅ Ultra-Compact & e ka oketšegago .
boima bja mmele feela .0,25kg ya 0,21kg .(e nyenyane ka ho fetisisa fapaneng) ho .6,45kg ., go kgontšha go kopanywa ka gare ga sebaka-ditshepedišo tše di thibetšwego le di-cobot.
✅ Wide Payload fapaneng .
E swara dikarolo ka polokego go tšwa go .2kg .go50kg ..
✅ Tshebediso ya pneumatic e sebetsang hantle .
E optimized .Tshebediso ya moea (51 ~ 200 l / mets) .ga6 bareng sebetsa khatello ea .(3 ~ 8 bareng fapaneng).
✅ Go tia ga diintaseteri .
Tšhomišo ye e ka botwago go tšwa go .5 tekanyo ho 60 tekanyo e .Dithemperetšha tša tikologo.
Kamoo e fetošago micro-alignment .
Phaphamadi ye e laolwago .
Mojule o tsena boemong bja go obamela ka go šomiša kgatelelo ya moya ye e laolwago.
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Multi-axis go kwa .
Pono ya ka ntle / disensara tactile lemoha 6-dof misalignment.
02
Phošollo e Mafolofolo .
Pneumatic actuators beha boemo ba .le tshepetšo .Ka dilepe tsohle ka nako e le nngwe.
03
Senotlolo sa Nanometer .
High-Di-clamp tša go se fetoge di dira gore modula o sepele ka tsela ye e loketšego ka lefela.
04
Maemo a bohlokwa a tirišo .
Silicon Photonics & Optical Comm Go logaganya .
Go logaganya mo go šomago ga dihlopha tša tlhale go ditšhipi tša laser/waveguides tšeo di nyakago sub-Micron Positional .leAngular nepahetseng (± 0,01 tekanyo ).
Go phuthela ga semiconductor mo go tšwetšego pele .
die-go-wafer, wafer-go-wafer bonding, le flip-kopano ya chip moo pušetšo ya go sekama e thibelago di-void.
Micro-Plasetso ya Optics .
Go logaganya dilentshe, di-prism, le diipone ka gare ga dimmojule tša LiDAR, di-headset tša AR/VR, le dikhamera tša endoscopic tšeo di nago le phošollo ya bohlokwa ya RX/Ry.
Kopano ya sesebediswa sa bongaka sa ho nepahala .
Mating micro-dikarolo tša fluidic, malebela a sedirišwa sa go bua, le implant sub-Dikopano tšeo di nyakago go nepagala ga 6-DOF.
High-Tlhagišo ya Elektroniki ya Segagane .
Fine-Go beakanya PCB-go-segokaganyi goba flex-go logaganya ga potologo pele ga go lokela / go elela gape.
COBOT-Micro ye e laolwago -Seboka .
Go kgontšha maatla-kobamelo ya 6-axis ye e lekanyeditšwego bakeng sa go nyalana ga karolo ye e bonolo yeo e latelwago ke go notlela ka go tia.
Tlhahlobo ya Optical ya go Itiriša (AOI) .
Go logaganya ka nepo dilentshe tša khamera goba dikgato tša sampole bakeng sa go utolla diphošo ka go godišwa mo go phagamego.
Hardware ya khomphutha ya quantum .
Go beakanya dikarolo tša qubit tšeo di nyakago athomo-scale positional le angular nepagalo.
Mafetšo
Mojule wa Pušetšo ya Nepo ya ACM o beakanya maemo a maswa a go logaganya ka bohlale ka go rarolla ditlhohlo tše di raraganego kudu tša 6-DOF Micro-position. Motswako wa yona o kgethegilego wa .Sub-Go boeletšwa ga Micron (± 0.02mm) ., Pušetšo ya Angular ye e šomago (± 3 Degree RZ, ± 6 tekanyo ya RX / RY) ., Taolo e bonolo ya matla (4 ~ 750N) ., le ultra-Compact Form Factor e dira gore e be bohlokwa bakeng sa di-photonic tša moloko tše di latelago-, didirišwa tša quantum, diphuthelwana tša semiconductor tše di tšwetšego pele, le micro-kopano ya tša kalafo. Moo di-compensator tša setšo di beakanyago feela boemo, ACM e tliša bokgoni bja sebaka ka botlalo – go fetoša ditekanyo tša poelo ka dikgopelong tšeo di lekantšwego ka di-nanometer le arc-metsotswana.
Dithegi tše di fišago .: ACM tefo unit trust, China ACM tefo unit trust bahlahisi, bafepedi, fektheri
